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研磨拋光機【EJW-460I/2CMP】

Name：研磨拋光機【EJW-460I/2CMP】

Model：EJW-460I/2CMP

Unit：PCS

Specification(Grade)：EJW-460I/2CMP

Price：USD 0.000

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Goods detail informatio

Features:
CMP Polishing Machine (EJW-460I/2CMP) is the professional equipment particularly used in CMP engineering to improve the chemical polishing technical specifications, and is a high-voltage corresponding 8-inch wafer two-axis simultaneous grinding system.
 
EJW-460I 2CMP

Specifications:
Grinding plate diameter Φ460mm
Corresponding wafer Φ8 inch wafer, 2-head type
Wafer fixing Vacuum chuck type
Fixing speed Mostly at 100r.p.m.
Power 2.2Kw 3-Phase 200V
Pressure device Air-type 80kg/axis (actual read voltage)
Driving force ~60r.p.m.(Motor-400w)
Rotating device ~30r.p.m.(Motor-400w)
Processing controller Desktop controller (load/speed)
Power supply 200VAC 3-Phase 30A
Compressed air 0.4MPa (4Kgf/cm2)
Machine size 1800mm*1000mm*1800mmH
 
Options:
Pin chuck-type vacuum fixture
Porous chuck-type vacuum plate fixture
Water stick plate-type fixture
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